Global COTS Components for Satellites Market 2022 - Snapshot

The global cots components for satellites market was valued at USD 2,044 million in 2021 to USD 3,776 million by 2028, progressing at a CAGR of 1.4% from 2022 to 2028

This industry report offers market estimates of the global market, followed by a detailed analysis of the subsystem, mass class, and region. The global market data on cots components for satellites can be segmented by subsystem: attitude determination and control subsystem, command and data handling system, communication subsystem, electrical and power subsystem, payload, propulsion control subsystem, thermal control subsystem, others. In 2021, the attitude determination and control subsystem segment made up the largest share of revenue generated by the cots components for satellites market. Cots components for satellites market is further segmented by mass class: 0-500kg, 501-1,000kg, 1,001kg and above. Based on region, the cots components for satellites market is segmented into: Asia Pacific, Europe, North America, Rest of the World (RoW).

The global cots components for satellites market is highly competitive. The leading players in the cots components for satellites market include Amplified Design LLC, Analog Devices Inc., BAE Systems plc, Cobham Limited, Curtiss-Wright Corporation, Data Device Corporation (DDC), Exxelia SAS, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Microchip Technology Inc., Micropac Industries Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Xilinx Inc.

The data-centric report focuses on market trends, status and outlook for segments. With comprehensive market assessment across the major geographies, the report is a valuable asset for the existing players, new entrants and the future investors.

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Part 1. Summary
Part 2. Introduction
Study period
Geographical scope
Market segmentation
Part 3. Cots components for satellites market overview
Part 4. Market breakdown by subsystem
Attitude determination and control subsystem
Command and data handling system
Communication subsystem
Electrical and power subsystem
Payload
Propulsion control subsystem
Thermal control subsystem
Others
Part 5. Market breakdown by mass class
0-500kg
501-1,000kg
1,001kg and above
Part 6. Market breakdown by region
Asia Pacific
Europe
North America
Rest of the World (RoW)
Part 7. Key companies
Amplified Design, LLC
Analog Devices, Inc.
BAE Systems plc
Cobham Limited
Curtiss-Wright Corporation
Data Device Corporation (DDC)
Exxelia SAS
GSI Technology, Inc.
Honeywell International Inc.
Infineon Technologies AG
Microchip Technology, Inc.
Micropac Industries, Inc.
STMicroelectronics N.V.
Texas Instruments Incorporated
Xilinx, Inc.
Part 8. Methodology

Companies Mentioned
Amplified Design LLC, Analog Devices Inc., BAE Systems plc, Cobham Limited, Curtiss-Wright Corporation, Data Device Corporation (DDC), Exxelia SAS, GSI Technology Inc., Honeywell International Inc., Infineon Technologies AG, Microchip Technology Inc., Micropac Industries Inc., STMicroelectronics N.V., Texas Instruments Incorporated, Xilinx Inc.

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