Global Panel Level Packaging Market 2023

Panel level packaging refers to the integration of multiple semiconductor chips on a single large panel, which is then diced into individual packages. It involves the assembly and interconnection of chips, redistribution layers (RDL), and other components on a panel substrate, providing a cost-effective and efficient packaging solution for semiconductor devices.

The global panel level packaging market is likely to register a CAGR of over 30.6% with an incremental growth of USD 2,843.8 million during the forecast period 2023-2029. The demand for advanced packaging solutions, driven by trends such as IoT, AI, 5G, and smart cities, has led to the adoption of panel level packaging. This technology enables higher integration and miniaturization of semiconductor devices, meeting the requirements of these emerging applications. Panel level packaging offers cost advantages over traditional wafer-level packaging, as it allows for the simultaneous assembly and testing of multiple chips on a larger panel. This leads to improved productivity, reduced material consumption, and lower manufacturing costs.

The report covers market size and growth, segmentation, regional breakdowns, competitive landscape, trends and strategies for global panel level packaging market. It presents a quantitative analysis of the market to enable stakeholders to capitalize on the prevailing market opportunities. The report also identifies top segments for opportunities and strategies based on market trends and leading competitors’ approaches.

Market Segmentation
Application: automotive, consumer electronics, telecommunication, others
Region: China, Europe, Japan, South Korea, Taiwan, United States, Rest of the World

This industry report offers market estimates and forecasts of the global market, followed by a detailed analysis of the application, and region. The global market for panel level packaging can be segmented by application: automotive, consumer electronics, telecommunication, others. The consumer electronics segment is estimated to account for the largest share of the global panel level packaging market, representing more than 51.2% of the total market. The expansion of the smartphone industry, increasing adoption of smart devices and wearables, and the rising use of consumer IoT devices in applications like smart homes are significant drivers for this segment. In recent years, there has been a trend towards miniaturization in the consumer electronics industry, resulting in smaller, lighter, and more portable devices. Each new generation of consumer electronics products showcases greater innovation, compactness, and energy efficiency compared to its predecessors. This trend creates high customer expectations for the next iteration, which becomes a crucial selling point for consumer electronics manufacturers. To meet the complex and evolving needs of the consumer electronics market, advanced semiconductor packaging technologies play a vital role.

Panel-level packaging has gained traction in devices with limited space requirements, such as smartphones. These devices demand high performance, energy efficiency, and compact form factor packaging. Consequently, the increased penetration of smartphones and similar devices in recent years has generated significant demand for panel-level packaging solutions.

Panel level packaging market is further segmented by region: China, Europe, Japan, South Korea, Taiwan, United States, Rest of the World. Taiwan held the largest revenue share in 2022. One of the primary driving factors for the growth of the panel-level packaging market in Taiwan is the strong presence of the semiconductor and electronics industries. Taiwan is known for its advanced manufacturing capabilities and expertise in semiconductor fabrication. This has led to the development of a robust ecosystem, including foundries, packaging and testing companies, and equipment suppliers. These factors contribute to Taiwans competitive advantage in offering panel-level packaging solutions, attracting both domestic and international players to invest in this market.

Another important factor driving the panel-level packaging market in Taiwan is the increasing demand for high-resolution displays in consumer electronics. With the growing popularity of smartphones, tablets, and televisions with higher pixel densities and larger screen sizes, there is a need for advanced packaging technologies that can accommodate these requirements. Panel-level packaging enables the precise assembly of components onto larger substrates, allowing for the production of high-quality, large-sized displays.

Additionally, the rising adoption of emerging technologies such as 5G, Internet of Things (IoT), and augmented reality (AR)/virtual reality (VR) further fuels the demand for panel-level packaging. These technologies require compact and lightweight devices with enhanced performance and power efficiency. Panel-level packaging offers the potential to meet these demands by enabling the integration of various components on a single substrate, optimizing space utilization, and minimizing interconnection lengths.

Major Companies and Competitive Landscape
The market research report covers the analysis of key stake holders of the global panel level packaging market. Some of the leading players profiled in the report include Advanced Semiconductor Engineering, Inc., DECA Technologies Inc., Fraunhofer Institute for Reliability and Microintegration IZM, Intel Corporation, JCET Group Co., Ltd. (STATS ChipPAC Ltd.), Nepes Corporation, PowerTech Technology Inc., Samsung Electronics Co., Ltd., Unimicron Technology Corporation, among others. In this report, key players and their strategies are thoroughly analyzed to understand the competitive outlook of the market.

Scope of the Report
To analyze and forecast the market size of the global panel level packaging market.
To classify and forecast the global panel level packaging market based on application, region.
To identify drivers and challenges for the global panel level packaging market.
To examine competitive developments such as mergers & acquisitions, agreements, collaborations and partnerships, etc., in the global panel level packaging market.
To identify and analyze the profile of leading players operating in the global panel level packaging market.

Why Choose This Report
Gain a reliable outlook of the global panel level packaging market forecasts from 2023 to 2029 across scenarios.
Identify growth segments for investment.
Stay ahead of competitors through company profiles and market data.
The market estimate for ease of analysis across scenarios in Excel format.
Strategy consulting and research support for three months.
Print authentication provided for the single-user license.

PART 1. INTRODUCTION
1.1 Description
1.2 Objectives of The Study
1.3 Market Segment
1.4 Years Considered for The Report
1.5 Currency
1.6 Key Target Audience
PART 2. RESEARCH METHODOLOGY
2.1 Primary Research
2.2 Secondary Research
PART 3. EXECUTIVE SUMMARY
PART 4. MARKET OVERVIEW
4.1 Introduction
4.2 Drivers
4.3 Restraints
PART 5. GLOBAL PANEL LEVEL PACKAGING MARKET BY APPLICATION
5.1 Automotive
5.2 Consumer electronics
5.3 Telecommunication
5.4 Others
PART 6. GLOBAL PANEL LEVEL PACKAGING MARKET BY REGION
6.1 China
6.2 Europe
6.3 Japan
6.4 South Korea
6.5 Taiwan
6.6 United States
6.7 Rest of the World
PART 7. COMPANY PROFILES
7.1 Advanced Semiconductor Engineering, Inc.
7.2 DECA Technologies Inc.
7.3 Fraunhofer Institute for Reliability and Microintegration IZM
7.4 Intel Corporation
7.5 JCET Group Co., Ltd. (STATS ChipPAC Ltd.)
7.6 Nepes Corporation
7.7 PowerTech Technology Inc.
7.8 Samsung Electronics Co., Ltd.
7.9 Unimicron Technology Corporation
DISCLAIMER

List Of Tables

Companies Mentioned

Advanced Semiconductor Engineering Inc., DECA Technologies Inc., Fraunhofer Institute for Reliability and Microintegration IZM, Intel Corporation, JCET Group Co. Ltd. (STATS ChipPAC Ltd.), Nepes Corporation, PowerTech Technology Inc., Samsung Electronics Co. Ltd., Unimicron Technology Corporation

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