Taiwanese IC Packaging & Testing Industry, 1Q 2020
The report finds that shipment value of the Taiwanese IC packaging and testing industry arrived over USD 4.33 billion in the fourth first quarter of 2019, up 4.3% sequentially and 10.6% year-on-year. While the demand for smartphones is likely to persist, HPC (High Performance Computing) and AI applications and products become major growth drivers to bolster the demand for high-end wafer-level packaging service. Shipment value of the industry is expected to have grown 18.8% year-on-year but declined 7.5% sequentially, reaching USD4.0 billion. The decline is mainly attributed to the seasonal cycle of the industry and the reduced working days due to COVID-19 pandemic.
Taiwanese IC Packaging and Testing Industry Shipment Value, 1Q 2018 - 2Q 2020
Taiwanese IC Packaging and Testing Industry Shipment Value by Service Type, 1Q 2018 - 2Q 2020
Taiwanese IC Packaging Industry Shipment Value, 1Q 2018 - 2Q 2020
Taiwanese IC Testing Industry Shipment Value, 1Q 2018 - 2Q 2020
Taiwanese IC Packaging Industry Shipment Value Rankings, 1Q 2018 - 4Q 2019
Taiwanese IC Packaging Industry Shipment Value by Vendor Tier, 1Q 2018 - 4Q 2019
Taiwanese IC Testing Industrys Shipment Value Rankings, 1Q 2018 - 4Q 2019
Taiwanese IC Testing Industry Shipment Value by Vendors Tier, 1Q 2018 - 4Q 2019
Taiwanese IC Packaging Industry Shipment Value by Customer Origin, 1Q 2018 - 4Q 2019
Taiwanese IC Packaging Industry Shipment Value Share by Customer Origin, 1Q 2018 - 4Q 2019
Taiwanese IC Testing Industry Shipment Value by Customer Origin, 1Q 2018 - 4Q 2019
Taiwanese IC Testing Industry Shipment Value Share by Customer Origin, 1Q 2018 - 4Q 2019
Exchange Rate, 1Q 2018 - 4Q 2019
Research Scope & Definitions
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