Development of JCET and Its Deployment Strategies (pre-order)

Since its acquisition of Singaporean STATS ChipPac in 2015, Chinese JCET (Jiangsu Changjiang Electronics Technology) has become the world’s third largest OSAT (Outsourced Semiconductor Assembly and Test) service provider. Over the years, JCET has continued to conduct M&A and joint venture projects with the government’s support to rapidly expand its technology competencies and business as the Chinese government has put in place a series of polices and provided funds to achieve semiconductor self-sufficiency. This report looks into JCET’s current status and strategies, sheds lights on major opportunities and challenges facing the company, and explores the future development of the industry.
 


1.Company History
1.1 Origin
1.2 Revenue
1.3 Research and Development
2. Joint Venture and M&A
2.1 Enhancing OSAT Capabilities via Horizontal Acquisition
2.1.1 STATS ChipPAC
2.1.2 ADI’s Singaporean Facility
2.2 One-stop Service Provision via Vertical Cooperation
2.2.1 SMICS
3.Global Deployment
3.1 Distribution of Factories Worldwide
3.2 Development of JCET’s Regional Factories
3.2.1 China
3.2.2 Singapore
3.2.3 Korea
4. Opportunities and Challenges
4.1 Opportunities
4.1.1 Domestic Market
4.1.2 Government Funding and Policy
4.2 Challenges
4.2.1 Overexpansion Results in Financial Problems
4.2.2 Low Technology Competencies and Product Quality
4.2.3 US Toughens Ban on Huawei
5. Conclusion
Appendix
List of Companies
 


List Of Tables

<p>Table 1 Services Provided by JCET&rsquo;s Regional Factories&nbsp;</p>
 


List Of Figures

<p>Figure 1 JCET&rsquo;s Shareholder Structure&nbsp;<br />
Figure 2 JCET&rsquo;s Revenue between 2010 and 2019&nbsp;<br />
Figure 3 Top 10 OSAT Service Providers Worldwide by Revenue and Ranking in 2019&nbsp;<br />
Figure 4 JCET&rsquo;s R&amp;D Spending between 2010 and 2019&nbsp;<br />
Figure 5 Distribution of JCET&rsquo;s Factories Worldwide&nbsp;</p>
 


Development and Strategic Position of the Global Semiconductor Industry Chain

With escalating geopolitical risks, ongoing conflicts, tighter monetary policies in Europe and the U.S., and variables such as uncertainties from national elections and natural disasters, global economic performance is expected

USD 1600 View Report

Development of Taiwans Third-Generation Semiconductor Industry and Key Players

Third-generation semiconductors primarily consist of wide bandgap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). Due to the combination of these two materials, these semiconductors are also referred

USD 1800 View Report

Development of Global Open RAN Market and Emerging SI Vendors

Open Radio Access Network (Open RAN) represents the next-generation architecture within the RAN market, primarily driven by telecom operators’ pursuit of independence from traditional equipment vendors and the increasing trend

USD 1200 View Report

Development of Taiwans Third-Generation Semiconductor Industry and Key Players

Third-generation semiconductors primarily consist of wide bandgap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). Due to the combination of these two materials, these semiconductors are also referred

USD 1800 View Report

Fill The Form For Sample Request

Note : * Kindly provide us with your company id and get the sample reports at the earliest.

There is no Reviews available