Development Trends of TWS Application Chips (pre-order)

As Bluetooth technology advances and smartphone brands sequentially remove the 3.5-mm headphone jack from their phones, the TWS (True Wireless Stereo) market has continued to grow. With market competition heating up, application IC vendors for TWS have constantly upgraded their technology. Eying on the growth potential of TWS, IC design houses have tapped into this market. This report begins with the current development of the TWS market, followed by an analysis of the trends in the TWS application IC industry, and examines some leading IC design houses’ deployment in the TWS market.
Table of Contents
1.Development of TWS
1.1 Trends towards Wireless Connectivity and Smart Functions
1.2 Enhanced Bluetooth Technology and Removal of 3.5mm Jack from Smartphones Drives TWS Development
1.3 Heated TWS Market Competition Pushes Leading Brands to Upgrade Services
2.Trends of the TWS Application IC Industry
2.1 Bluetooth SoC and MCU as Key Components in TWS Systems
2.2 Major Development Trends of TWS
2.2.1 Trend #1: Leading Chipmakers Develop In-house Bluetooth Solutions
2.2.2 Trend #2: Focus on Low Latency Technology
2.2.3 Trend #3: Bluetooth SoC with ANC Becoming a Must-have in Mid-range and High-end TWS
2.2.4 Trend #4: Noise Cancellation and Voice Assistant Boost Demand for MEMS Microphones
2.2.5 Trend #5: Increased Adoption of SiP Technology in Mid-range and High-end TWS
3.Application IC Suppliers’ Deployment in TWS
3.1 Most IC Suppliers Already Extend Reach to TWS
3.2 Leading Bluetooth IC Suppliers Tap into Chinese Customers’ Supply Chains
3.2.1 Airoha Technology’s Bluetooth Technology Favored by Chinese Customers
3.2.2 Realtek Taps into Mid-range and High-end Market Segments with Low Power Consumption Feature
3.2.3 PixArt Imaging Launches Wireless Audio SoC for Chinese Customers through Subsidiary Audiowise Technology
3.3 Majority of Taiwanese MCUs and Sensors Supplied to Chinese Brands
3. MIC Perspective
Appendix
List of Companies

List Of Tables

Table 1 Top 5 TWS Brands’ New Products in 2020 

Table 2 Latency of Major Bluetooth SoCs

Table 3 Application IC Suppliers for TWS  

Table 4 Airoha Technology’s Bluetooth ICs for TWS 

Table 5 Realtek’s Bluetooth ICs for TWS

Table 6 PixArt Imaging’s Bluetooth ICs for TWS


 


List Of Figures

Figure 1 Evolution of Headphones
Figure 2 Functional Blocks of TWS
Figure 3 Leading Chipmakers

Bluetooth Technology Used for TWS

Companies Mentioned
AAC Technologies
Actions Semiconductor
Airoha Technology
Amazon
Anker
Apple
Beats Electronics
Bestechnic
Bestechnic
Bluetrum
Broadcom
Edifier Technology
Goertek
Google
Havit
HiVi Acoustics Technology
Holtek
Huawei
Injoinic Technology
JBL
JLab LLC
Joway
Koss
Lenovo
Macronix
Master & Dynamic
MediaTek
Nakamichi
Nuvoton Technology
NXP
Oppo
Origin International
Philips
PixArt Imaging
PXI
QCY
Qualcomm
Razer
Realtek
Samsung
SG Micro
Sitronix
Sony
Spreadtrum Communications
STMicroelectronics
Texas Instrument
Tontek
Toshiba
Tozo
Will Semiconductor
Winbond Electronics
Xiaomi
Zilltek Technology

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