Development Of Smart Automotive Electronic Control Units by Leading Chipmakers (pre-order)

With the burgeoning advancement of smart car-related technologies such as smart cockpits, connected vehicles, and advanced driver assistance systems (ADAS), automotive electronic control units (ECUs), which act as the brain of vehicles, are poised to enhance vehicle functionalities. In recent years, leading international chipmakers have delved into product development in this domain. Both traditional automotive chip manufacturers and emerging players in the information and communication chip sector have launched products tailored to diverse market segments while meeting the stringent safety and reliability standards of the automotive industry. This report explores the development landscape of automotive ECUs by major chipmakers, including Qualcomm, Nvidia, MediaTek, NXP, and TI.

Audi
AUO
Benz
BMW
Cadillac
Chevelle
E-Mirror
Ford
Foxconn
GM
Hyundai Motor
Infineon
Jaguar
Lenovo
Lucid Motors
MediaTek
Mercedes-Benz
NIO
Nvidia
NXP
oToBrite
Qualcomm
Renesas
STMicro
TI
Volvo
Weltmeister
Wistron
XPeng Motors
Zeekr
Table of Contents
1. Preface
1.1 Scope of Smart Automotive ECUs
2. Development of Leading Chipmakers’ Smart Automotive ECUs
2.1 Qualcomm
2.1.1 Snapdragon Car-to-Cloud Services
2.1.2 Snapdragon Auto Connectivity Platform
2.1.3 Snapdragon Cockpit Platform
2.1.4 Snapdragon Ride Platform for ADAS
2.1.5 Snapdragon Ride Flex Leads the Integration Trend of Smart Cockpit & ADAS (Cockpit-driving Integration)
2.1.6 Key Aspects of Qualcomms Strategic Expansion in the Automotive Market
2.2 Nvidia
2.2.1 Nvidia Xavier
2.2.2 Nvidia Drive Orin
2.2.3 Nvidia Drive Thor
2.2.4 Nvidia Drive Hyperion Full-Stack Solution
2.2.5 Nvidias Full Range of Solutions Boast Scalability & High Computing Power
2.3 MediaTek
2.3.1 Autus Brand (1st Generation Products)
2.3.2 Dimensity Auto Brand (2nd Generation Products)
2.3.3 Leveraging Advantages in Consumer Electronics for Automotive Connectivity Solutions
2.4 NXP
2.4.1 NXP S32 Platform
2.4.2 Continued Optimization in Image Perception and Information Security
2.5 TI
2.5.1 Jacinto 7 Processor Platform
2.5.2 TDA4 ADAS Solution
2.5.3 Implementing Redundancy in Product Applications
3. Comparison of Leading Chipmakers Smart Automotive ECUs
3.1 Leading Chipmakers Secure Market Share in Different Computing Segments
3.2 ECUs Diverging Towards Distributed and Centralized Architectures
4. MIC Perspective
Appendix
List of Companies

List Of Tables

Table 1: Comparison of Qualcomms Representative Smart Cockpit Products

 

Table 2: Comparison of Nvidia Products

 

Table 3: Comparison of TIs Core Computing Processors

List Of Figures

Figure 1: Qualcomm’s Four Major Automotive Product Lines


Figure 2: Architecture of Snapdragon Cockpit Platform

 

Figure 3: Level Differentiation of Snapdragon Ride Platform

 

Figure 4: Architecture and Features of Snapdragon Ride Flex

 

Figure 5: Application Scope of Snapdragon Ride Flex

 

Figure 6: Evolution of Nvidia Drive Chips

 

Figure 7: Architecture of Nvidia Xavier Chip

 

Figure 8: Architecture of Nvidia Drive Hyperion Full-Stack Solution (Using Hyperion 8 as an Example)

 

Figure 9: Illustration of MediaTek Dimensity Auto Products

 

Figure 10: Comparison of TIs ADAS Solutions

 

Figure 11: Major Chipmakers Dominate Product Segments with Varying Computing Power Requirements

 

Figure 12: Major Chipmakers Products Shift From Distributed to Centralized Architectures

Development and Strategic Position of the Global Semiconductor Industry Chain

With escalating geopolitical risks, ongoing conflicts, tighter monetary policies in Europe and the U.S., and variables such as uncertainties from national elections and natural disasters, global economic performance is expected

USD 1600 View Report

Development of Taiwans Third-Generation Semiconductor Industry and Key Players

Third-generation semiconductors primarily consist of wide bandgap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). Due to the combination of these two materials, these semiconductors are also referred

USD 1800 View Report

Development of Global Open RAN Market and Emerging SI Vendors

Open Radio Access Network (Open RAN) represents the next-generation architecture within the RAN market, primarily driven by telecom operators’ pursuit of independence from traditional equipment vendors and the increasing trend

USD 1200 View Report

Development of Taiwans Third-Generation Semiconductor Industry and Key Players

Third-generation semiconductors primarily consist of wide bandgap semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN). Due to the combination of these two materials, these semiconductors are also referred

USD 1800 View Report

Fill The Form For Sample Request

Note : * Kindly provide us with your company id and get the sample reports at the earliest.

There is no Reviews available